- Ultimate Heat Conductivity
- Non-Electrical Conductive
- Non-Curing & No Bleeding
- Strong Shaping
Gelid Ultimate Thermal Putty are designed to provide perfect thermal contact to the heatsink when installed on PCBs with height differences and uneven surfaces such as micro-controller units, memory ICs, analog ICs, MOSFETs, and other SMD components.
GN-Ultimate Thermal Putty is a versatile material for gap filling, achieving low thermal resistance and an ultra-thin effect under pressure, ideal for multiple chips sharing a heat sink.
Density (g/cm°): 3.3
Temperature Range(°C): -30~200
Net Content: 30g
